2UUL · 商品编号 SOL-STN068
2UUL FD40 Chip 芯片加热拆焊台
$4.49
$5.99
-25% · 已省 $1.50
● 现货
- Specifically designed for softening and removing chip underfill; effectively lowers disassembly difficulty and reduces the risk of damage to chips and motherboards
- Utilizes an efficient heating block structure to ensure uniform heat transfer to the base of the chip, improving glue softening efficiency and repair stability
- The 16x17mm heating area is suitable for common ICs and BGA chips on mobile phone motherboards, enabling precise heating without affecting surrounding components
- Preheating to soften the underfill helps minimize issues such as pad detachment, circuit damage, and chip deformation caused by forced disassembly
- Suitable for BGA chip disassembly, reballing/rework, and pre-soldering preparation, thereby increasing the success rate of subsequent repairs
数量
起订量: 10
| 品牌 | 2UUL |
| 商品编号 | SOL-STN068 |
| 适配机型 | Universal / 通用 |
| 电压 / 插头 | - |
| 功率 | - |
| 温度 | - |
| 质保 | 12 个月 |
| 起订量 | 10 pcs |
订单在 48 小时内从深圳发出。空运快线 5-9 个工作日，经济物流 12-20 个工作日。订单满 $300.00 免空运运费。
包装清单: 主机 1 台、电源线 1 根、英文说明书 1 份，以及所需配件与夹具。批量订单可按需提供零售彩盒包装。
支持 T/T 银行转账、PayPal、Wise、西联汇款、支付宝与信用卡。大宗订单可 30% 定金、发货前付清尾款。
