2UUL FD40 Chip Heating Glue Removal Station for C210 Handle

• Specifically designed for softening and removing chip underfill; effectively lowers disassembly difficulty and reduces the risk of damage to chips and motherboards
• Utilizes an efficient heating block structure to ensure uniform heat transfer to the base of the chip, improving glue softening efficiency and repair stability
• The 16x17mm heating area is suitable for common ICs and BGA chips on mobile phone motherboards, enabling precise heating without affecting surrounding components
• Preheating to soften the underfill helps minimize issues such as pad detachment, circuit damage, and chip deformation caused by forced disassembly
• Suitable for BGA chip disassembly, reballing/rework, and pre-soldering preparation, thereby increasing the success rate of subsequent repairs