Relife TO6 Pure Copper with Gold Plating Desoldering Needle Set for BGA Package Chip Desoldering

• TO6 pure copper with gold plating desoldering needle set, specially designed for motherboard repair desoldering, with a spherical head design that does not scratch or damage sockets and motherboards, especially suitable for BGA package chip desoldering
• Even and Fast, Full Tinning: Pure copper gold-plated desoldering needle set, especially suitable for BGA package chip desoldering
• Pure Copper Gold-plated Needle Tip: The needle tip uses high-purity copper with gold plating, improving tinning speed by 50>#/li###
• Round Sphere Design: The round ball head design is smooth without edges, does not scratch or damage sockets and the motherboard
• Simple And Convenient Operation: It can be operated conveniently even in narrow spaces, without easily scratching inline sockets