MiJing · SKU PH-HLD060
Mijing R12 Chip degumming fixture for BGA IC Glue Removal
$7.99
$9.99
-20% · You save $2.00
● In Stock
- chip removal fixture offers a large-travel design suitable for securing large chips and mobile phone CPUs—making it particularly ideal for precise immobilization during chip debonding and repair processes.
- provides a maximum travel distance of 23.5mm, making it suitable for securing and debonding larger chips.
- crafted from high-grade materials, ensuring superior quality and long-term durability.
- for large-format chips and the majority of mobile phone CPUs, enabling it to handle more complex repair tasks.
Quantity
Min. Order: 10
| Brand | MiJing |
| SKU | PH-HLD060 |
| Compatible Model | Universal / 通用 |
| Voltage / Plug | - |
| Power | - |
| Temperature | - |
| Warranty | 12 months |
| Min. Order | 10 pcs |
Orders are dispatched within 48 hours from Shenzhen. Express shipping takes 5-9 business days, economy shipping 12-20 business days. Free express shipping on orders over $300.00.
Package Includes: 1 x main unit, 1 x power cable, 1 x English user manual, required accessories and fixtures. Retail boxes are available on request for bulk orders.
T/T bank transfer, PayPal, Wise, Western Union, Alipay and credit card. Bulk orders support 30% deposit with balance before shipment.
Related Products
-30%
WL
WL Multifunctional Vise Repair Fixture for Camera / Dot Matrix / Chips and Motherboards
$6.99
$9.99
CODE: PH-HLD006
