MiJing · 商品编号 PH-HLD059
MiJing Z22MAX Reballing 主板夹具
$0.00
$17.99
-100% · 已省 $17.99
● 现货
- Mijing Z22MAX Reballing/Glue Removal 2-in-1 Platform for iPhone Android
- 2-in-1 Design: Integrates both chip degumming and reballing functions, boosting repair efficiency and minimizing tool-switching time.
- Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
- Strong Magnetic Adsorption: Features powerful magnetic adsorption capabilities to ensure the chip remains firmly fixed and motionless during the repair process, preventing the loss of tiny chips.
- High Compatibility: Universally compatible with the Z21MAX reballing stencil; widely supports A13–A19 Pro CPUs as well as most Android CPUs, enhancing its versatility across various repair tasks.
数量
起订量: 10
| 品牌 | MiJing |
| 商品编号 | PH-HLD059 |
| 适配机型 | Universal / 通用 |
| 电压 / 插头 | - |
| 功率 | - |
| 温度 | - |
| 质保 | 12 个月 |
| 起订量 | 10 pcs |
订单在 48 小时内从深圳发出。空运快线 5-9 个工作日，经济物流 12-20 个工作日。订单满 $300.00 免空运运费。
包装清单: 主机 1 台、电源线 1 根、英文说明书 1 份，以及所需配件与夹具。批量订单可按需提供零售彩盒包装。
支持 T/T 银行转账、PayPal、Wise、西联汇款、支付宝与信用卡。大宗订单可 30% 定金、发货前付清尾款。
